Drain Extended Field Effect Transistors and Methods of Formation Thereof

ABSTRACT

In an embodiment of the invention, a semiconductor device includes a first region having a first doping type, a channel region having the first doping type disposed in the first region, and a retrograde well having a second doping type. The second doping type is opposite to the first doping type. The retrograde well has a shallower layer with a first peak doping and a deeper layer with a second peak doping higher than the first peak doping. The device further includes a drain region having the second doping type over the retrograde well. An extended drain region is disposed in the retrograde well, and couples the channel region with the drain region. An isolation region is disposed between a gate overlap region of the extended drain region and the drain region. A length of the drain region is greater than a depth of the isolation region.

This is a divisional application of application Ser. No. 13/020,368filed on Feb. 3, 2011, which is incorporated herein by reference.

TECHNICAL FIELD

This invention relates generally to semiconductor devices and methods,and more particularly to drain extended field effect transistors andmethods of forming thereof.

BACKGROUND

As electronic components are becoming smaller and smaller along with theinternal structures in integrated circuits, it is becoming easier toeither completely destroy or otherwise impair electronic components. Inparticular, many integrated circuits are highly susceptible to damagefrom the discharge of static electricity. Generally, electrostaticdischarge (ESD) is the transfer of an electrostatic charge betweenbodies at different electrostatic potentials or voltages, caused bydirect contact or induced by an electrostatic field. The discharge ofstatic electricity, or ESD, has become a critical problem for theelectronics industry.

Device failures resulting from ESD events are not always immediatelycatastrophic or apparent. Often, the device is only slightly weakenedbut is less able to withstand normal operating stresses. Such a weakeneddevice may result in reliability problems such as increased leakagecurrents resulting in degraded performance of the device.

System-on-Chip (SoC) ICs are produced in advanced CMOS technologieswhere no gate oxides of appropriate thickness are available for costreasons. In such applications, one challenge is to provide an ESD robusthigh voltage (HV) transistor element which has excellent mixed signalperformance and gate oxide reliability.

Such HV devices should operate over a wide range of interface voltage,e.g., 5V to 12V. Such wide interoperability allows them to used forapplications such as for an input/output (IO) circuit implemented in aSoC.

One option is to use drain extended field effect transistors alsoreferred as drain extended MOS devices (DeMOS) for IO drivers in SoCICs. DeMOS transistors are asymmetric in the drain and sourceconstruction allowing large voltages to be directly applied to thetransistor pads.

However, DeMOS transistors are ESD-weak and require additionalprotective circuitry to prevent damage from ESD. Additional ESDcircuitry, however, increases the cost of the chip.

Therefore, to improve efficiency of silicon real estate and reduce thechip cost, DeMOS transistors with good ESD immunity are required.

FIG. 1 illustrates a conventional drain extended metal oxidesemiconductor (DeMOS) (n-channel) transistor.

Referring to FIG. 1, a substrate 100 comprises a p-body region 10. Ap-well region 20 and an n-well region 30 are disposed adjacent and havea common p-n junction as illustrated. Isolation regions comprising adrain sided isolation region 40 and other isolation regions 41 (e.g.,STI—Shallow Trench Isolation) are formed within the substrate 100. Thechannel region 35 of the DeMOS transistor 1 is formed within the p-wellregion 20. A source region 50 having a n⁺ doping is disposed within thep-well region 20 of the substrate 100. A drain region 60 having a n⁺doping is disposed within the n-well region 30 of the substrate 100. Asubstrate contact region 70 having a p⁺ doping is disposed within thep-well region 20 to contact the p-well region 20. A gate 80 is disposedbetween the source region 50 and the drain region 60. Spacers 45 aredisposed on the sidewalls of the gate 80. Under normal operation as afield effect transistor (FET), e.g., when an inversion layer is formedwithin the channel region 35, the charge carriers from the source region50 move across the channel region 35 and flow through an extended drainregion 51 (shown by the arrow) around the STI corners before reachingthe drain region 60. Thus portions of the n-well region 30 under thedrain-sided isolation region 40 and the gate 80 form part of the drainof the DeMOS transistor 1.

As a consequence, the potential from the drain contact of the drainregion 60 is dropped due to the increased resistance of the lower dopedn-well region 30 that forms the extended drain region 51. Thedrain-sided isolation region 40 underneath gate-to-drain overlap is usedto protect device from any gate oxide failure while applying high biasat the drain region 51. However, such a device configuration resultsinto space charge modulation due to localized current distribution andcause a very early thermal failure of the device, which is attributed tofilament formation. As will be described in detail below, thisconstruction results in poor ESD performance requiring additionalcircuitry to protect the device against ESD damage.

Hence what are needed are devices that are robust against ESD stress.

SUMMARY OF THE INVENTION

These and other problems are generally solved or circumvented, andtechnical advantages are generally achieved, by illustrative embodimentsof the present invention.

In accordance with an embodiment of the present invention, asemiconductor device comprises a first region having a first doping typedisposed in a substrate, a channel region having the first doping typedisposed in the first region, and a retrograde well having a seconddoping type disposed in the substrate. The second doping type isopposite to the first doping type. The retrograde well has a shallowerlayer with a first peak doping and a deeper layer with a second peakdoping, which is higher than the first peak doping. The semiconductordevice further comprises a drain region having the second doping typedisposed in the substrate over the retrograde well. An extended drainregion is disposed in the retrograde well and comprises a gate overlapregion. The extended drain region couples the channel region with thedrain region. An isolation region is disposed between the gate overlapregion of the extended drain region and the drain region. A length ofthe drain region is greater than a depth of the isolation region.

In accordance with another embodiment of the present invention, a drainextended field effect transistor comprises a first region having a firstdoping type disposed in a substrate, a source region disposed in orabove the first region, and a retrograde well having a second dopingtype disposed in the substrate. The second doping type is opposite tothe first doping type. The first region and the retrograde well have acommon junction. The retrograde well has a first layer having a lowerpeak doping than a deeper second layer. The drain extended field effecttransistor further comprises a drain region disposed in or above theretrograde well. A channel region is disposed between the source regionand the drain region in the first region. A gate is disposed above thesubstrate between the source region and the drain region. An extendeddrain region is disposed in the retrograde well and comprises a gateoverlap region. The extended drain region couples the channel regionwith the drain region. An isolation region is disposed between the gateoverlap region and the drain region. A depth of the first layer isgreater than a depth of the isolation region.

In accordance with another embodiment of the present invention, a methodof forming a semiconductor device comprises forming a first regionhaving a first doping type in a substrate, forming a first well byimplanting dopants of a second doping type into the substrate at a firstimplant condition, and forming a second well by implanting dopants ofthe second doping type into the substrate at a second implant condition.The second doping type is opposite to the first doping type. The secondwell is disposed within the first well. The second implant condition hasan implant dose smaller than an implant dose of the first implantcondition. The second implant condition has an implant energy lower thanan implant energy of the first implant condition. The method furthercomprises forming an isolation region in the second well, forming asource region in or above the first region, and forming a drain regionin or above the second well. A length of the drain region is greaterthan a depth of the isolation region. A channel region is formed betweenthe source region and the drain region in the first region. An extendeddrain region is formed in the first and the second wells. The extendeddrain region couples the channel region with the drain region. Theextended drain region comprises a gate overlap region. The isolationregion is disposed between the gate overlap region and the drain region.

The foregoing has outlined rather broadly the features of an embodimentof the present invention in order that the detailed description of theinvention that follows may be better understood. Additional features andadvantages of embodiments of the invention will be describedhereinafter, which form the subject of the claims of the invention. Itshould be appreciated by those skilled in the art that the conceptionand specific embodiments disclosed may be readily utilized as a basisfor modifying or designing other structures or processes for carryingout the same purposes of the present invention. It should also berealized by those skilled in the art that such equivalent constructionsdo not depart from the spirit and scope of the invention as set forth inthe appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present invention, and theadvantages thereof, reference is now made to the following descriptionstaken in conjunction with the accompanying drawing, in which:

FIG. 1 illustrates a conventional drain extended metal oxidesemiconductor (DeMOS) (n-channel) transistor;

FIG. 2, which includes FIGS. 2 a-2 c, illustrates the ESD performance ofthe conventional device illustrated in FIG. 1, wherein FIG. 2 aillustrates experimental performance, and wherein FIGS. 2 b-2 cillustrates the failure mechanism using device simulation;

FIG. 3 illustrates a DeMOS transistor in accordance with an embodimentof the invention;

FIG. 4, which includes FIGS. 4 a-4 e, illustrates an alternativeembodiment of the invention, wherein FIG. 4 a illustrates a schematiccross sectional view, FIG. 4 b illustrates experimental ESD and MOSoperational data, FIG. 4 c shows the Id-Vd curves under normal MOSoperation, FIG. 4 d illustrates a simulated charge density profilesusing a device simulator, and FIG. 4 e illustrates the correspondingsimulated electric field;

FIG. 5 is an alternative embodiment of the DeMOS transistor including adrain spacer layer to space out the drain region from the isolationregion;

FIG. 6 illustrates another embodiment of a DeMOS transistor including adrain spacer layer adjacent the drain region and a deep n-region underthe p-well region;

FIG. 7 illustrates an embodiment of a DeMOS transistor having noseparate p-well region;

FIG. 8 illustrates an alternative embodiment of a DeMOS transistorhaving a hetero-epitaxial channel region;

FIG. 9 illustrates a p-channel DeMOS transistor in accordance with anembodiment of the invention;

FIG. 10, which includes FIGS. 10 a-10 c, illustrates further embodimentsof the DeMOS device;

FIG. 11 illustrates another embodiment of the invention having multiplefinger structures;

FIG. 12, which includes FIGS. 12 a-12 g, illustrates a method ofmanufacturing the DeMOS transistor in accordance with embodiments of theinvention; and

FIG. 13 illustrates possible ranges for parameters described in variousembodiments of the invention.

Corresponding numerals and symbols in the different figures generallyrefer to corresponding parts unless otherwise indicated. The figures aredrawn to clearly illustrate the relevant aspects of the embodiments andare not necessarily drawn to scale.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

The making and using of various embodiments are discussed in detailbelow. It should be appreciated, however, that the present inventionprovides many applicable inventive concepts that can be embodied in awide variety of specific contexts. The specific embodiments discussedare merely illustrative of specific ways to make and use the invention,and do not limit the scope of the invention.

FIG. 2, which includes FIGS. 2 a-2 c, illustrates the ESD performance ofthe device illustrated in FIG. 1, wherein FIG. 2 a illustratesexperimental performance, and wherein FIGS. 2 b-2 c illustrates thefailure mechanism using device simulation.

Referring to FIG. 2 a, the lower x-axis represents the drain voltage(e.g., voltage in drain region 60 in FIG. 1). The upper x-axisrepresents the leakage current (sub-threshold leakage and gate leakage)during normal operation of the device after ESD stress. The y-axisrepresents the drain current I_(TLP) (ESD pulse) used to stress thedevice. Note that drain current I_(TLP) is absolute current and notcurrent per unit width as conventionally used.

The plot of I_(TLP) v. drain voltage represents the behaviour of thedevice during ESD stress. An ESD pulse is applied for 100 ns on thedrain terminal of the DeMOS transistor 1 while grounding the otherterminals of the DeMOS transistor. The I_(TLP) v. drain voltage showsthe increase in drain voltage as the magnitude of the current pulse isincreased.

The plot of I_(TLP) v. leakage current represents the normal operationalleakage current (OFF current) after the ESD stress. As illustrated aftera critical drain current I_(TLP) the leakage current increasesexponentially. This critical drain current (I_(t2)) is the maximum ESDstress that the device can take before the device is permanentlydamaged. Therefore, the critical drain current (I_(t2)) is a measure ofthe ESD immunity of the DeMOS transistor.

As illustrated in FIG. 2 a, the conventional DeMOS device fails afterstressing with a drain current I_(TLP) of about 20 mA, which is 0.75mA/μm—a very low value. I/O devices should be immune to as much aspossible ESD stress current (4-5 mA/μm is considered as an acceptablerange). Otherwise additional ESD protection circuitry should beintroduced to protect the I/O devices increasing the cost of the chip.Embodiments of the invention overcome these and other limitations ofconventional DeMOS devices.

FIGS. 2 b-2 c illustrates the failure mechanism of the conventionaldevice illustrated in FIG. 1.

As described herein, using technology computer aided design (TCAD)models, the inventors have identified the reasons for the failure of theconventional DeMOS transistors.

FIGS. 2 b and 2 c illustrate simulation results of a DeMOS transistorafter being subjected to the ESD stress. FIG. 2 b shows the currentdensity (A/cm2) within the DeMOS transistor at the end of the ESD pulseof I_(TLP) of 1.2 mA/μm. The corresponding electric field profile withinthe transistor is shown in FIG. 2 c.

Under ESD stress, the transistor behaves like an npn bipolar transistor.The source region 50 forms the emitter, the p-well region 20 forms thebase and the n-well region 30 (extended drain) form the collector, andthe drain region 60 form the sub-collector.

Referring first to FIG. 2 b, the diode between the source region 50 andthe p-well region 20 is triggered. However, there is no damage to thedevice at this stage. As illustrated by the current density profiles,the peak current density flows around the drain-sided isolation region40. However, the current flow is localized under the drain-sidedisolation region 40 and into the drain region 60. Importantly, themaximum current density increases from the p-well region 20/n-wellregion 30 junction towards the drain region 60, where it is highlylocalized.

This also impacts the electric field within the device. In other words,under low drain voltages, the transistor has a well defined junctionboundary between the p-well region 20 (p type base) and the n-wellregion 30. However, as ESD stress voltage is increased (which increasesthe current density), the excess charge in the n-well region 30(extended drain) becomes comparable or greater than the fixed ionizedimpurity concentration of the n-well region 30. The excess electrons mayinduce excess holes to maintain quasi-neutrality and thereby extend thep-type base from the p-well region 20/n-well region 30 junction to thehigher doped drain region 60. In other words, the p-type base regionextends until it reaches the higher doped drain region 60 where theexcess electron concentration becomes comparable or less than the fixedionized impurity concentration.

As a direct consequence, the high electric field region is pushed fromthe p-well region 20/n-well region 30 junction to a smaller area underthe drain region 60.

This is clearly illustrated in FIG. 2 c showing high electric fields ina first region 65 under the drain region 60. In contrast, in a secondregion 55 adjacent the junction between the p-well region 20 and then-well region 30, there is minimal space charge resulting in lowelectric fields. This phenomenon—also called “base push out” or “basewidening”—results in high electric fields in the first region 65.

The high electric field and/or high current densities locally breaksdown the silicon lattice. For example, portions of the silicon may breakdown, e.g., locally melt down, forming silicon filaments.

Embodiments of the invention overcome these problems by minimizing thebase push out phenomenon without introducing higher ON resistance pathsthat may degrade performance of the DeMOS transistor under normal FEToperation. This is achieved by creating a doping structure that reducesthe base widening mechanism, which is achieved by placing higher dopedregions in the current path and avoiding concentration of currentdensity in a localized region.

Structural embodiments of DeMOS transistors having improved ESD immunitywithout compromising performance will be described with respect to FIGS.3-11. Methods of forming DeMOS transistors in accordance withembodiments of the invention will be described using FIG. 12.

FIG. 3 illustrates a DeMOS transistor in accordance with an embodimentof the invention.

The DeMOS transistor 1 includes a substrate 100 with a p-body region 10.A p-well region 20 is disposed within the substrate 100. Isolationregions comprising the drain-sided isolation region 40 and otherisolation regions 41 are formed within the substrate 100. The channelregion 35 of the DeMOS transistor 1 is formed within the p-well region20. A source region 50 is disposed within the p-well region 20 of thesubstrate 100. A drain region 60 is disposed within the n-well region 30of the substrate 100. A substrate contact region 70 is disposed withinthe p-well region 20 to contact the p-well region 20. A gate 80 isdisposed between the source region 50 and the drain region 60. Asilicide region 61 is disposed on the drain region 60. Spacers 45 aredisposed on the sidewalls of the gate 80.

However, in this embodiment, a retrograde n-well 130 is formed withinthe substrate 100 adjacent the p-well region 20. The retrograde n-well130 forms a p-n junction with the p-well region 20. The retrograden-well 130 comprises a first n-well region 131 having a doping N_(INT)and a second n-well region 132 having a doping N_(B). The doping N_(INT)of the first n-well region 131 is lower than the doping N_(B) of thesecond n-well region 132 thereby forming the retrograde n-well 130. Thehigher doping of the second n-well region 132 distributes more of thecharge carriers into the second n-well region 132. Because the secondn-well region 132 is designed to be deeper and away from the drainregion 60, the electric field peak region is also shifted back adjacentthe p-well region 20/second n-well region 132.

In various embodiments, the ratio of the doping N_(B) of the secondn-well region 132 to the doping N_(INT) of the first n-well region 131is at least 3:1, and about 10:1 in one embodiment. In variousembodiments, the doping of the p-well region 20 is about 5×10¹⁶ cm⁻³ toabout 10¹⁸ cm⁻³, the doping N_(INT) of the first n-well region 131 isabout 1×10¹⁷ cm⁻³ to about 5×10¹⁸ cm⁻³, the doping N_(B) of the secondn-well region 132 is about 10¹⁸ cm⁻³ to about 5×10¹⁹-cm⁻³.

Because of the existence of the drain-sided isolation region 40 furtherprecautions should be taken to realize the reversal of base push out.

The length RL of the gate overlap over the extended drain region 51 istypically pre-determined in achieving the transistor operatingperformance. In various embodiments, very small values of the length RLof the gate overlap should be avoided to avoid increase in chargedensity concentration around and under the left edge of the drain-sidedisolation region 40. In one embodiment, the value of RL may be at least150 nm to obtain a specified level of On current.

The depth D_(ST) of the drain-sided isolation region 40 should begreater than the depth XJ of the drain region 60. If the depth XJ of thedrain region 60 approaches the depth D_(ST) of the drain-sided isolationregion 40, significant portion of the charge carriers are distributed ina small region under the drain-sided isolation region 40 and around theright corner of the drain-sided isolation region 40. Again this can beavoided by reducing the depth XJ of the drain region 60 relative to thedepth D_(ST) of the drain-sided isolation region 40. In variousembodiments, the depth D_(ST) of the drain-sided isolation region 40should be at least twice the depth XJ of the drain region 60.

In various embodiments, the length DL of the drain region 60 should begreater than the depth D_(ST) of the drain-sided isolation region 40. Inone embodiment, the length DL of the drain region 60 should be abouttwice or at least twice of the depth D_(ST) of the drain-sided isolationregion 40. The larger area of the drain region 60 relative to theisolation depth helps to ensure that the charge carriers are distributedacross the well region. For example, if the area of the drain region 60is much smaller than the isolation depth, the charge carriers areconcentrated along the right sidewall of the drain-sided isolationregion 40. This would result in break down of the silicon along theisolation sidewalls. In contrast, if the area of the drain region 60 ismuch larger than the isolation depth, the charge carriers will be spacedout along the right sidewall of the drain-sided isolation region 40thereby avoiding any break down in that region.

In various embodiments, a depth D_(B) of the first n-well region 131should be greater than the depth D_(ST) of the drain-sided isolationregion 40. In various embodiments, a depth D_(B) of the first n-wellregion 131 is at least 1.3× the depth D_(ST) of the drain-sidedisolation region 40. If the depth D_(B) of the first n-well region 131approaches or is less than the depth D_(ST) of the drain-sided isolationregion 40, the second n-well region 132 is disposed under thedrain-sided isolation region 40. As a consequence, all the chargecarriers are distributed in a thin zone immediately under thedrain-sided isolation region 40, which increases the susceptibility ofthis region under the drain-sided isolation region 40 to break down. Bymoving the second n-well region 132 away from the drain-sided isolationregion 40, this charge localization can be prevented avoiding breakdownin a region under the drain-sided isolation region 40.

Embodiments of the invention also may require that the depth D_(ST) ofthe drain-sided isolation region 40 is greater than the width X of thedrain-sided isolation region 40.

In various embodiments, the length SL of the silicide region 61 shouldbe about the same as the length DL of the drain region 60. In variousembodiments, the width of the silicide region 61 is also about the sameas the width of the drain region 60, which is about the same as thewidth of the DeMOS transistor, the width of the silicide region 61,width of the drain region 60, and the width of the DeMOS transistorbeing measured perpendicular to the current flow direction. A smallsilicide region 61 can result in high current density through a smallregion within the silicide region 61 and/or around the silicide region61 in the drain region 60 resulting in break down of the silicide region61 and/or the drain region 60.

Advantageously, the embodiments of the invention do not impact the ONcurrent of the transistor because the spaced out carrier distributionhelps to improve the sheet resistance of the extended drain region 51due to reduced scattering between carriers at lower current densities.Further, the higher doped regions if in the path of the current flowwill further decrease the drain resistance.

FIG. 4, which includes FIGS. 4 a-4 c, illustrates an alternativeembodiment of the invention, wherein FIG. 4 a illustrates a schematiccross sectional view, FIG. 4 b illustrates experimental ESD and MOSoperational data, FIG. 4 c shows the Id-Vd curves under normal FEToperation, FIG. 4 d illustrates charge density profiles after simulatingan ESD pulse using a TCAD device simulation, and FIG. 4 e illustratesthe electric fields corresponding to FIG. 4 d.

As illustrated in FIG. 4 a, the embodiment of FIG. 4 includes all thefeatures described with respect to FIG. 3 but also includes anadditional deep n-well region 110. The deep n-well region 110 is addedto prevent latch up of the transistor (and/or to decouple the channelregion 35 from the often noisy substrate) and does not change theoperational aspects with respect to the ESD and normal MOS operationdescribed above.

Referring to FIG. 4 b, the plot of I_(TLP) v. drain voltage of ESDstress shows the increase in drain voltage as the magnitude of thecurrent pulse is increased. However, unlike the conventional device, thedevice using embodiments of the invention attain a much higher draincurrent I_(TLP) (critical drain current I′_(t2)) before reaching similar(failing) drain voltage. However, the critical drain current I_(t2) ofthe conventional device is at least 5× lower than the critical draincurrent I′_(t2) of the embodiment.

The plot of I_(TLP) v. leakage current illustrates this improvement.Unlike the conventional device which failed at around 20 mA, theembodiment device is immune from ESD stress up to 100 mA. Thus, themaximum ESD stress that the device can take before the device ispermanently damaged is increased about five times using embodiments ofthe invention.

FIG. 4 c illustrates the drain current I_(DS) v. drain voltage V_(DS)under MOS operation for two different gate voltages. As illustrated inthe Figure, there is no significant difference in ON currents. Forexample, at a gate-source voltage of 1.2 V and at a drain-source voltageof 5.0V, the ON current of both is about 275 μA/μm.

FIG. 4 d illustrates the charge density profiles across the DeMOS deviceof FIG. 4 a under ESD stress.

The ESD pulse (100 ns) was simulated at a drain current I_(TLP) of 2mA/μm within the DeMOS transistor of FIG. 4 a using a TCAD devicesimulator. The ESD pulse is applied to the drain of the DeMOS transistorand the charge density profiles are illustrated after the end of thestress pulse. The dashed arrow follows the peak of the current density.The charge flow is triggered at the junction between p-well region 20and the first n-well region 131 and flows under the drain-sidedisolation region 40. Unlike the simulation of the conventional device(FIG. 2 b), using embodiments of the invention, the charge density ismore relaxed (spread out) both under the drain-sided isolation region 40and under the drain region 60. The peak charge density under the drainregion 60 is much lower using embodiments of the invention than in theconventional device by about 4×.

As expected, the electric field profile (FIG. 4 e) does not show highelectric field region under/around the drain region 60 unlike theconventional device of FIG. 2 c. Rather, the peak electric field islocated at the p-well region 20/retrograde n-well 130 in the secondregion 55 and not in the first region 65 as in FIG. 2 c.

FIG. 5 is an alternative embodiment of the DeMOS transistor.

The DeMOS transistor is similar to the embodiment of FIG. 3 butadditionally includes a drain spacer layer 133 adjacent the drain region60. The drain spacer layer 133 may have the opposite doping as thesource drain, and may be a p-type region for a n-channel DeMOStransistor. The drain spacer layer 133 may be doped to varyingconcentrations and may be a p⁻ region, a p region, or a p⁺ region.However, for a p-channel DeMOS transistor, the drain spacer layer 133may be doped to be a n-type region. Having a region of opposite dopingprevents peak current flow along the sidewalls of the drain-sidedisolation region 40. However, in this embodiment care should be taken toprevent forming a contact to the drain spacer layer 133 or all thecharge density flow will be steered into the small drain spacer layer133. Therefore, to ensure that the drain spacer layer 133 is always afloating region, the length SL of the silicide region 61 should be lessthan the length DL of the drain region 60. This ensures that thesilicide region 61 does not accidentally contact the drain spacer layer133, e.g., due to misalignment errors. Therefore, in one embodiment, thedrain spacer layer 133 may be covered by an isolation region (silicideblock 46), e.g., a silicon nitride layer disposed adjacent the spacers45. In other embodiments, the silicide block 46 may not be a spacer i.e.may not contact the spacer 45.

In some embodiments, the drain spacer layer 133 may be a counter-dopedstarting from the originally N+ doped layer to result in a p-type dopedregion or may also be an intrinsic region. In such embodiments, the n+doping of the drain region is moved away from the drain-sided isolationregion 40 thereby partially pushing out the current from the sidewallsof the drain-sided isolation region 40 thereby reducing the magnitude ofthe charge density peaks adjacent the drain-sided isolation region 40compared to the embodiment of FIG. 3.

FIG. 6 illustrates another embodiment of FIG. 4 having a drain spacerlayer 133 as in FIG. 5 but also including the deep n-well region 110.

This embodiment is functionally similar with respect to the ESD stressimmunity as the embodiment of FIG. 5.

FIG. 7 illustrates an embodiment of a DeMOS transistor having noseparate p-well region. Rather, in this embodiment, the channel region35 of the DeMOS transistor 1 is formed within the p-body region 10without forming a separate p-well region 20 (as in FIG. 3). Theoperation of this DeMOS transistor 1 is similar to that described withrespect to FIG. 3.

FIG. 8 illustrates an alternative embodiment of a DeMOS transistorhaving a hetero-epitaxial layer 210. In one embodiment, the region underthe gate, which is the hetero-epitaxial layer 210, comprises anepitaxial SiGe layer so that the channel region 35 comprises SiGe. TheSiGe layer may be used to improve carrier mobility for improving theperformance of the MOS transistor. In alternative embodiments, thehetero-epitaxial layer 210 may comprise Ge, or III-V materials such asInSb, InP etc.

FIG. 9 illustrates a p-channel DeMOS transistor in accordance with anembodiment of the invention.

Although the embodiments of FIGS. 3-8 have been described with respectto n-channel DeMOS transistors, the various embodiments described so farcan be applied to p-channel DeMOS transistors as well. As an example,FIG. 9 illustrates a p-channel DeMOS transistor 2 having a retrogradep-well 330.

The p-channel DeMOS transistor 2 comprises a deep n-well region 110formed over a p-body region 10 of the substrate 100. Isolation regionscomprising drain-sided isolation region 40 and other isolation regions41 are formed within the substrate 100 as in prior embodiments. Ann-well region 30 is disposed within the substrate 100 over the deepn-well region 110. The channel region 35 of the p-channel DeMOStransistor 2 is formed within the n-well region 30.

A source region 50 having a p⁺ doping is disposed within the n-wellregion 30 of the substrate 100. A drain region 60 having a p⁺ doping isdisposed within the retrograde p-well 330 of the substrate 100. Acontact region 70 having a n⁺ doping is disposed within the n-wellregion 30 to contact the n-well region 30. As in previous embodiments, agate 80 is disposed between the source region 50 and the drain region60, and spacers 45 are disposed over the sidewalls of the gate 80 andcontact the sidewalls of the gate 80. A silicide region 61 is disposedon the drain region 60.

The p-well retrograde well 330 comprises a first p-well region 331having a doping N_(INT) and a second p-well region 332 having a dopingN_(B). The doping N_(INT) of the first p-well region 331 is lower thanthe doping N_(B) of the second p-well region 332 thereby forming theretrograde p-well 330.

As in prior embodiments, the retrograde doping of the p-well retrogradewell 330 distributes more of the charge carriers into the second p-wellregion 332 so as to relocate the electric field region from the drainregion 60 back to the n-well region 30/second p-well region 332.

The layout and doping rules are similar to the n-channel DeMOStransistors described above in various embodiments. These are brieflyrepeated again below for convenience.

In various embodiments, the ratio of the doping N_(B) of the secondp-well region 332 to the doping N_(INT) of the first p-well region 331is at least 3:1, and about 10:1 in one embodiment. In variousembodiments, the doping of the n-well region 30 is about 5×10¹⁶ cm⁻³ toabout 10¹⁸ cm⁻³, the doping N_(INT) of the first p-well region 331 isabout 1×10¹⁷ cm⁻³ to about 5×10¹⁸ cm⁻³, the doping N_(B) of the secondp-well region 332 is about 10¹⁸ cm⁻³ to about 5×10¹⁹ cm⁻³.

As described above, the depth D_(ST) of the drain-sided isolation region40 should be greater than the junction XJ of the drain region 60, thelength DL of the drain region 60 should be greater than the depth D_(ST)of the drain-sided isolation region 40, the depth D_(B) of the firstn-well region 131 should be greater than the depth D_(ST) of thedrain-sided isolation region 40, and the depth D_(ST) of the drain-sidedisolation region 40 may be greater than the width X of the drain-sidedisolation region 40. In various embodiments, the length SL of thesilicide region 61 is about the same as the length DL of the drainregion 60.

Embodiments of the p-channel transistor 2 may also include theembodiments described with respect to FIGS. 5-8. For example, a drainspacer layer having a n-type region may be used to push the p⁺ drainregion 60 of the p-channel transistor 2 away from the drain-sidedisolation region 40.

FIG. 10, which includes FIGS. 10 a-10 c, illustrates further embodimentsof the DeMOS device.

FIG. 10 a illustrates an embodiment of the invention in which the gate80 and/or the spacer 45 does not overlap the top surface of thedrain-sided isolation region 40. The embodiment helps to move thecarrier flow away from the sidewalls of the drain-sided isolation region40 thereby preventing high charge density regions, which may bevulnerable to breakdown.

FIG. 10 b illustrates an alternative embodiment including a gate spacerregion 91. In this embodiment, the gate spacer region 91 is formedhaving the same doping type as the drain region 60. The gate spacerregion 91 is a floating region in that it is not coupled to a contact(any metallization, or any silicide). The heavier doping of the gatespacer region 91 relative to the first n-well region 131 prevents chargedepletion near the drain-sided isolation region 40 thereby reducingparasitic effects.

FIG. 10 c illustrates an alternative embodiment having a gate spacerregion 91. In this embodiment and unlike the embodiment of FIG. 10 b,the gate spacer region 91 is formed having the opposite doping type asthe drain region 60. Again, the gate spacer region 91 is a floatingregion in that it is not coupled to a contact (any metallization). Theheavier doping of the gate spacer region 91 relative to the first n-wellregion 131 prevents carrier flow adjacent the edge of the drain-sidedisolation region 40.

FIG. 11 illustrates another embodiment of the invention having multiplefinger structures. While not separately illustrated embodiments of thedevices described above, for example FIGS. 3, 4, 5-9, 10 also includedevices having shared drain regions. In such embodiments, the device hasa mirror symmetry along a vertical line, for example, along line 11′ inFIG. 11. In such embodiments, the device includes two channel regions: achannel region 35 formed within the p-well region 20, and anotherchannel region 135 formed within the other p-well region 120, which iscoupled through another substrate contact region 170. The other channelregion 135 is coupled to another source region 150. Thus the device hasat least two gates: a gate 80 and another gate 180 as illustrated. Asillustrated in FIG. 11, and as described above in various embodiments,the depth D_(ST) of the drain-sided isolation region 40 should begreater than the junction depth XJ of the drain region 60, the depthD_(B) of the first n-well region 131 should be greater than the depthD_(ST) of the drain-sided isolation region 40, and the depth D_(ST) ofthe drain-sided isolation region 40 may be greater than the width X ofthe drain-sided isolation region 40. In various embodiments, thefull-length SL′ of the silicide region 61 is about the same as thefull-length DL′ of the drain region 60. Because the drain region 60 is ashared drain of two DeMOS transistors, the half-length DL of the drainregion 60 should be greater than the depth D_(ST) of the drain-sidedisolation region 40 so that the full-length DL′ of the drain region 60should be greater than twice the depth D_(ST) of the drain-sidedisolation region 40.

FIG. 12, which includes FIGS. 12 a-12 g, illustrates a method ofmanufacturing the DeMOS transistor in accordance with embodiments of theinvention.

As an illustration, a process flow for manufacturing a n-channel DeMOStransistor is described, however, the same methods may be applied to ap-channel DeMOS transistor.

Referring to FIG. 12 a, a p-body region 10 is formed within thesubstrate 100. The substrate 100 may include a silicon bulk substrate ora silicon on insulator substrate. The substrate 100 may includeepitaxial layers over a bulk crystalline semiconductor material.

Isolation regions comprising drain-sided isolation region 40 and otherisolation regions 41 are formed within the substrate 100. The isolationregions may be formed using shallow trench isolation technology in oneembodiment, or deep trench isolation in some embodiments.

Referring to FIG. 12 b, a p-well region 20 is formed within the p-bodyregion 10. The p-well region 20 may be formed using an implantationstep, which follows masking of a portion of the substrate 100. Forexample, a first mask layer 510 may be formed using lithographytechniques. A p-type dopant, e.g., boron, is implanted into thesubstrate 100. An optional anneal may be used to activate the dopantsforming the p-well region 20. In some embodiments, the well anneal maybe performed after implanting all the required wells within thesubstrate 100.

As illustrated in FIG. 12 c, a retrograde well 130 is next formed withinthe substrate. The first mask layer 510 is removed and a new maskmaterial is coated over the substrate 100. Using lithography the maskmaterial is patterned forming a second mask layer 520.

Next, n-type dopants e.g., phosphorus, arsenic, and/or antimony, areimplanted into the opening forming the retrograde n-well 130. In variousembodiments, n-type dopant implantation is performed in at least twosteps. In a first step, n-type dopants at a first energy and a firstdose are implanted to form a first n-well region 131 having a peakdoping of N_(INT).

In a second step, n-type dopants at a second energy and a second dosemay be implanted to form a second n-well region 132 having a dopingN_(B). The first and the second steps may be performed in any order. Invarious embodiments, the first energy is about 50 keV to about 300 keVof phosphorus, the second energy is about 200 keV to about 1 MeV ofphosphorus. The first dose is about 5×10¹² cm⁻² to about 10¹⁴ cm⁻², andthe second dose is about 5×10¹³ cm⁻² to about 5×10¹⁴ cm⁻². The implantdoses and energies of the first and the second implant are selected soas to satisfy the condition that the peak doping N_(B) of the secondn-well region 132 is less than the peak doping N_(INT) of the firstn-well region 131.

The substrate 100 is annealed to remove the implanted damage andactivate the dopants. The well anneal may form both the retrograden-well 130 and the p-well region 20 in various embodiments. In variousembodiments, the well anneal may be a high temperature rapid thermalanneal, for example, between about 900° C. to about 1100° C., andgreater than or equal to 1000° C. in one example embodiment. In someembodiments, the well anneal may also be a furnace anneal having alonger anneal time. For example, in one embodiment, a 10 s anneal at1000° C. may be performed. The second mask layer 520 may be removedprior to or after the well anneal.

As next illustrated in FIG. 12 d, a gate stack comprising a gate 80 anda gate dielectric is formed over the substrate 100.

The gate dielectric may comprise a plurality of layers, and may be anoxide, a nitride, an oxynitride, and/or a high-k dielectric material.The gate 80 may comprise a polysilicon material in one embodiment. Inother embodiments, the gate 80 may comprise a metallic material. Thegate 80 is formed by depositing a gate material and patterning them intogate lines. Spacers 45 are formed adjacent the gate 80 over thesidewalls of the gate 80. The spacers 45 may comprise a single layer ormay be a plurality of layers of a same material or different materials.

Referring next to FIG. 12 e, a source region 50 and a drain region 60are formed. A substrate contact region is masked during this step, forexample, using a third mask layer 530. The source and the drain regions50 and 60 may be formed by implanting a low energy n-type dopant intothe substrate 100. For example, arsenic ions at an energy of about 10keV to about 50 keV may be implanted to form the source region 50 andthe drain region 60. In other embodiments, phosphorus ions at an energyof about 5 keV to about 30 keV may be implanted. In various embodiments,both phosphorus and arsenic may be both implanted to form the sourceregion 50 and the drain region 60. The implant dose may be about 10¹⁴cm⁻² to about 5×10¹⁵ cm⁻². The gate 80 may also be implanted at thistime in some embodiments. In one of the other examples, the source andthe drain regions 50 and 60 may be formed by epitaxial growth of Si,SiGe, SiC on top of the substrate 100. Such embodiments may include araised structure (raised source/drain) wherein a top surface of thesource and the drain regions 50 and 60 is above the top surface of thesubstrate 100.

As next illustrated in FIG. 12 f, the third mask layer 530 is removedand replaced with a fourth mask layer 540 thereby opening the substratecontact region. An implant of p-type dopants may be performed into thesubstrate 100 thereby forming the substrate contact region 70 within thep-well region 20.

A source/drain activation anneal may follow the implantations toactivate the dopants in the source region 50, the drain region 60, andthe substrate contact region 70, and optionally also the gate 80. Thesource/drain activation anneal may be a high temperature rapid thermalanneal including a spike anneal, a millisecond anneal such as a flashanneal, less than millisecond anneals such as laser anneals, and/orcombinations such as flash assisted spike anneals. In one embodiment,the source/drain activation anneal comprises a spike anneal of at least900° C. for less than about 1 s. In another embodiment, the source/drainactivation anneal may include a millisecond anneal of at least 1000° C.

As illustrated in FIG. 12 g, a silicide region 61 is formed. Asdescribed above, in some embodiments, the silcide region 61 has adifferent size than the underlying drain region 60 (e.g., FIG. 6). Insuch embodiments, an optional silicide block is formed over regions ofthe drain region 60 that are not to be silicided. In one exampleembodiment, a nitride layer may be deposited and patterned forming asilicide block before depositing a metal for silicidation. In oneexample embodiment, the nitride may be formed as an additional spacerover the spacers 45. A metal such as nickel or cobalt may be depositedover the exposed source region 50, the drain region 60, the substratecontact region 70, and the gate 80. An appropriate anneal is performedto convert a portion of the semiconductor in the substrate 100 into asilicide material. Excess metal is removed leaving the silicide region61.

Further processing may continue as in conventional semiconductorprocessing, for example, to form contacts and interconnects.

FIG. 13 illustrates possible ranges for each of the parameters describedabove with respect to FIGS. 3-11 calculated in accordance with anembodiment of the invention.

For example, at the 20 nm technology node, as illustrated, a depth ofthe drain region may be about 50 nm to about 60 nm, a depth of theisolation region may be about 200 nm to about 240 nm, a depth of theshallower layer may be about 220 nm to about 260 nm, the length of thedrain region may be greater than about 500 nm, the first peak doping maybe about 4×10¹⁷ cm⁻³ to about 6×10¹⁷ cm⁻³, and the second peak dopingmay be about 2×10¹⁸ cm⁻³ to about 3×10¹⁸ cm⁻³.

In another example embodiment, at the 32 nm technology node, a depth ofthe drain region may be about 70 nm to about 80 nm, a depth of theisolation region may be about 270 nm to about 310 nm, a depth of theshallower layer may be about 290 nm to about 330 nm, the length of thedrain region may be greater than about 600 nm, the first peak doping maybe about 3×10¹⁷ cm⁻³ to about 5×10¹⁷ cm⁻³, and the second peak dopingmay be about 1×10¹⁸ cm⁻³ to about 2×10¹⁸ cm⁻³.

In another example embodiment, in a highly scaled technology, a depth ofthe drain region may be about 30 nm to about 40 nm, a depth of theisolation region may be about 170 nm to about 210 nm, a depth of theshallower layer may be about 190 nm to about 230 nm, the length of thedrain region may be greater than about 400 nm, the first peak doping maybe about 5×10¹⁷ cm⁻³ to about 7×10¹⁷ cm⁻³, and the second peak dopingmay be about 3×10¹⁸ cm⁻³ to about 4×10¹⁸ cm⁻³.

The assignment of the technology nodes is used only for illustration. Invarious embodiments, DEMOS devices built on prior technology node may bescaled more and may look more like a lower node. Similarly, in variousembodiments, DEMOS devices built on a newer technology node may bescaled less and may look more like a prior technology node device.

Although the present invention and its advantages have been described indetail, it should be understood that various changes, substitutions andalterations can be made herein without departing from the spirit andscope of the invention as defined by the appended claims. For example,it will be readily understood by those skilled in the art that many ofthe features, functions, processes, and materials described herein maybe varied while remaining within the scope of the present invention.

Moreover, the scope of the present application is not intended to belimited to the particular embodiments of the process, machine,manufacture, composition of matter, means, methods and steps describedin the specification. As one of ordinary skill in the art will readilyappreciate from the disclosure of the present invention, processes,machines, manufacture, compositions of matter, means, methods, or steps,presently existing or later to be developed, that perform substantiallythe same function or achieve substantially the same result as thecorresponding embodiments described herein may be utilized according tothe present invention. Accordingly, the appended claims are intended toinclude within their scope such processes, machines, manufacture,compositions of matter, means, methods, or steps.

What is claimed is:
 1. A semiconductor device comprising: a first regionhaving a first doping type disposed in a substrate; a channel regionhaving the first doping type disposed in the first region, wherein thechannel region comprises a hetero epitaxial semiconductor materialdifferent from the material of the substrate; a retrograde well having asecond doping type disposed in the substrate, the second doping typebeing opposite to the first doping type, the retrograde well having ashallower layer of a first peak doping and a deeper layer of a secondpeak doping higher than the first peak doping; a drain region having thesecond doping type disposed in the substrate over the retrograde well;an extended drain region disposed in the retrograde well coupling thechannel region with the drain region, the extended drain regioncomprising a gate overlap region; and an isolation region disposedbetween the gate overlap region of the extended drain region and thedrain region,
 2. The device of claim 1, wherein a length of the drainregion is greater than a depth of the isolation region.
 3. The device ofclaim 1, further comprising: a source region disposed in or over asubstrate; and a gate disposed over the substrate between the sourceregion and the drain region.
 4. The device of claim 1, wherein theisolation region extends deeper into the substrate than the drainregion.
 5. The device of claim 1, wherein the shallower layer extendsdeeper into the substrate than the isolation region.
 6. The device ofclaim 1, wherein a depth of the isolation region is greater than alateral width of the isolation region.
 7. The device of claim 1, whereina depth of the drain region is about 90 nm to about 100 nm, a depth ofthe isolation region is about 330 nm to about 370 nm, a depth of theshallower layer is about 350 nm to about 400 nm, the length of the drainregion is greater than about 700 nm, the first peak doping is about2×10¹⁷ cm⁻³ to about 4×10¹⁷ cm⁻³, and the second peak doping is about1×10¹⁸ cm⁻³ to about 2×10¹⁸ cm⁻³.
 8. The device of claim 1, wherein adepth of the drain region is about 60 nm to about 70 nm, a depth of theisolation region is about 230 nm to about 270 nm, a depth of theshallower layer is about 250 nm to about 290 nm, the length of the drainregion is greater than about 550 nm, the first peak doping is about3×10¹⁷ cm⁻³ to about 5×10¹⁷ cm⁻³, and the second peak doping is about2×10¹⁸ cm⁻³ to about 3×10¹⁸ cm⁻³.
 9. The device of claim 1, wherein adepth of the drain region is about 40 nm to about 50 nm, a depth of theisolation region is about 180 nm to about 220 nm, a depth of theshallower layer is about 200 nm to about 240 nm, the length of the drainregion is greater than about 450 nm, the first peak doping is about4×10¹⁷ cm⁻³ to about 6×10¹⁷ cm⁻³, and the second peak doping is about2×10¹⁸ cm⁻³ to about 3×10¹⁸ cm⁻³.
 10. The device of claim 1, furthercomprising a silicide region disposed over the drain region, wherein asurface area of the silicide region is about the same as a surface areaof the drain region.
 11. The device of claim 1, further comprising adrain spacer layer disposed laterally adjacent the drain region betweenthe isolation region and the drain region, wherein an exposed topsurface of the drain spacer layer is covered by an insulating materialso that the drain spacer layer is separated from a metallic material byan insulating material region or a semiconductor region.
 12. The deviceof claim 11, further comprising a silicide region disposed over thedrain region, wherein the silicide region is spaced away from the drainspacer layer.
 13. The device of claim 11, wherein the drain spacer layercomprises a doping opposite to the doping of the drain region.
 14. Thedevice of claim 11, wherein the drain spacer layer comprises a same typeof doping as the doping of the drain region, and wherein the drainspacer layer has a lower doping than the drain region.
 15. The device ofclaim 1, wherein the semiconductor device is a n-channel drain extendedmetal oxide semiconductor (DeMOS) transistor, wherein the drain regioncomprises heavily doped n⁺ regions, and wherein the retrograde well isan n-type region.
 16. The device of claim 1, wherein the semiconductordevice is a p-channel drain extended metal oxide semiconductor (DeMOS)transistor, wherein the drain region comprises heavily doped p⁺ regions,and wherein the retrograde well is a p-type region.
 17. The device ofclaim 1, further comprises: a second region having the first doping typedisposed in the substrate; another channel region having the firstdoping type disposed in the second region; another extended drain regiondisposed in the retrograde well coupling the another channel region withthe drain region, the other extended drain region comprising anothergate overlap region; and another isolation region disposed between theother gate overlap region of the other extended drain region and thedrain region, wherein a length of the drain region is greater than twotimes the depth of the other isolation region.
 18. A semiconductordevice comprising: a first region having a first doping type disposed ina substrate; a channel region having the first doping type disposed inthe first region; a retrograde well having a second doping type disposedin the substrate, the second doping type being opposite to the firstdoping type, the retrograde well having a shallower layer of a firstpeak doping and a deeper layer of a second peak doping higher than thefirst peak doping; a drain region having the second doping type disposedin the substrate over the retrograde well; an extended drain regiondisposed in the retrograde well coupling the channel region with thedrain region, the extended drain region comprising a gate overlapregion; and an isolation region disposed between the gate overlap regionof the extended drain region and the drain region; a gate spacer regiondisposed between the gate and the isolation region, wherein an exposedtop surface of the gate spacer region is covered by an insulatingmaterial so that the gate spacer region is separated from a metallicmaterial by an insulating material region or a semiconductor region. 19.The device of claim 18, wherein the gate spacer region is intrinsic orhas a first doping type.
 20. The device of claim 18, wherein the gatespacer region has a second doping type.
 21. The device of claim 18,wherein a length of the drain region is greater than a depth of theisolation region.
 22. A method of forming a semiconductor device, themethod comprising: forming a first region having a first doping type ina substrate; forming a first well by implanting dopants of a seconddoping type into the substrate at a first implant condition, the seconddoping type being opposite to the first doping type; forming a secondwell by implanting dopants of the second doping type into the substrateat a second implant condition, wherein the second well is disposedwithin the first well, the second implant condition having an implantdose smaller than an implant dose of the first implant condition, thesecond implant condition having an implant energy lower than an implantenergy of the first implant condition; forming an isolation region inthe second well; forming a source region in or above the first region;forming a drain region in or above the second well, wherein a length ofthe drain region is greater than a depth of the isolation region;forming a channel region between the source region and the drain regionin the first region; and forming an extended drain region in the firstand the second wells, the extended drain region coupling the channelregion with the drain region, the extended drain region comprising agate overlap region, wherein the isolation region is disposed betweenthe gate overlap region and the drain region.
 23. The method of claim22, wherein a depth of the isolation region is greater than a depth ofthe drain region, and wherein a depth of the first region is greaterthan a depth of the isolation region.
 24. The method of claim 22,further comprising forming a silicide region over the drain region,wherein a surface area of the silicide region is about the same as asurface area of the drain region.
 25. The method of claim 22, furthercomprising: forming a drain spacer layer of the first doping typelaterally adjacent the drain region between the isolation region and thedrain region, the drain spacer layer contacting a sidewall of theisolation region; and forming a silicide region over the drain region,wherein the silicide region is spaced away from the drain spacer layer.